Depaneling

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Depaneling is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often designed so that they consist of many smaller individual PCBs that will be used in the final product. This PCB cluster is called a panel or multiblock. The large panel is broken up or "depaneled" as a certain step in the process - depending on the product, it may happen right after SMT process, after in-circuit test (ICT), after soldering of through-hole elements, or even right before the final case-up of the assembly.

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