Reactive-ion etching

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A commercial reactive-ion etching setup in a cleanroom

Reactive-ion etching (RIE) is an etching technology used in microfabrication. It uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.

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• Related: Plasma etcher

BYU Cleanroom – RIE Etching BYU Cleanroom – RIE Etching www.ee.byu.edu/cleanroom/rie_etching.phtml - Web

Bosch Process Bosch Process www.oxfordplasma.de/process/sibo_1.htm - Web

Plasma Etch Fundamentals Plasma Etch Fundamentals www.clarycon.com/plasmaetchfundam.html - Web

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UC Davis Northern California Nanotechnology Center... UC Davis Northern California Nanotechnology Center: RIE Operating Manual ncnc.engineering.ucdavis.edu/pages/equipment/rie.html - Web

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